The AX9500 is a cutting-edge Standalone 3D X-ray Inspection Equipment, representing the latest advancements in technology. This versatile system is capable of performing CT detection on a wide range of semiconductor components, including BGA, CSP, flip chips, and LEDs. Additionally, it excels in SMT welding analysis. Featuring a 3D tomography CT scanning system, which includes both planar CT and cone beam CT, it provides comprehensive imaging solutions for intricate semiconductor inspection needs. This equipment is at the forefront of non-destructive testing, ensuring precise and detailed analysis of components.
Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT)
Applications
Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum die-casting mold castings, molded plastic parts, etc.
Images
System Summary
| Footprint | 1700(W)*1660(D)*1900(H)mm |
| Machine Weight | ≈2700kg |
| Max.Tube Power | 64W |
| Max.Target Power | 15W |
| Max.Voltage / Current | 160kV/1000μA |
| X-Ray Leakage | <0.5μSv/h |
Imaging System
| Tube Type | Open tube |
| Resolution | 1 μm(Optional 0.5μm) |
| Detector | FPD |
| System Magnification | 600X |
Inspection Area
| Max. Inspection Dimension | 530*470mm |
| Max.Load Dimension | 600*545mm |
| Max.Inspection Area (XL Size) | 610*1200mm |
| Motion Control Mode | Joystick Mouse& Keyboard |
| Detector Angle | 360° full viewing angle, 2*70 degree tilt |
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